PROTECTION OF INTEGRATED CIRCUITS

PROTECTION OF INTEGRATED CIRCUITS

A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the...

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Hauptverfasser: FARISON, Denis, RIVIERE, Jean-Michel, COFFY, Romain
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator FARISON, Denis
RIVIERE, Jean-Michel
COFFY, Romain
description A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023245984A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023245984A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023245984A13</originalsourceid><addsrcrecordid>eNrjZFAMCPIPcXUO8fT3U_B3U_D0C3F1D3IMcXVRcPYMcg71DAnmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGRiamlhYmjobGxKkCALMpI1M</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PROTECTION OF INTEGRATED CIRCUITS</title><source>esp@cenet</source><creator>FARISON, Denis ; RIVIERE, Jean-Michel ; COFFY, Romain</creator><creatorcontrib>FARISON, Denis ; RIVIERE, Jean-Michel ; COFFY, Romain</creatorcontrib><description>A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230803&amp;DB=EPODOC&amp;CC=US&amp;NR=2023245984A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230803&amp;DB=EPODOC&amp;CC=US&amp;NR=2023245984A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FARISON, Denis</creatorcontrib><creatorcontrib>RIVIERE, Jean-Michel</creatorcontrib><creatorcontrib>COFFY, Romain</creatorcontrib><title>PROTECTION OF INTEGRATED CIRCUITS</title><description>A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAMCPIPcXUO8fT3U_B3U_D0C3F1D3IMcXVRcPYMcg71DAnmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGRiamlhYmjobGxKkCALMpI1M</recordid><startdate>20230803</startdate><enddate>20230803</enddate><creator>FARISON, Denis</creator><creator>RIVIERE, Jean-Michel</creator><creator>COFFY, Romain</creator><scope>EVB</scope></search><sort><creationdate>20230803</creationdate><title>PROTECTION OF INTEGRATED CIRCUITS</title><author>FARISON, Denis ; RIVIERE, Jean-Michel ; COFFY, Romain</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023245984A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>FARISON, Denis</creatorcontrib><creatorcontrib>RIVIERE, Jean-Michel</creatorcontrib><creatorcontrib>COFFY, Romain</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FARISON, Denis</au><au>RIVIERE, Jean-Michel</au><au>COFFY, Romain</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROTECTION OF INTEGRATED CIRCUITS</title><date>2023-08-03</date><risdate>2023</risdate><abstract>A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PROTECTION OF INTEGRATED CIRCUITS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T20%3A47%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FARISON,%20Denis&rft.date=2023-08-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023245984A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true