POWER MODULE AND RELATED METHODS

Implementations of semiconductor packages may include a substrate, a first die coupled on the substrate, and a lead frame coupled over the substrate. The lead frame may include a die attach pad. Implementations of semiconductor packages may also include a second die coupled on the die attach pad. Th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK, JeongHyuk, LEE, Keunhyuk, IM, Seungwon, BAEK, Jonghwan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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