METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION STRUCTURES

A substrate is described with a thermal dissipation structure sintered to thermal vias. In one example, a microelectronic module includes a recess between first and second substrate surfaces. One or more thermal vias extend between the first substrate surface and the interior recess surface, wherein...

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Bibliographische Detailangaben

Hauptverfasser:	Viswanathan, Lakshminarayan, Li, Lu, van Straten, Freek Egbert
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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