METHOD OF MANUFACTURE OF FAN-OUT TYPE SEMICONDUCTOR PACKAGE

A method of manufacture for a semiconductor package includes; forming a first wiring structure, connecting a semiconductor chip to the first wiring structure, forming a lower encapsulant on the first wiring structure to cover at least a portion of a lateral surface of the semiconductor chip, wherein...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JANG, SEHOON, LEE, SANGKYU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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