CIRCUIT BOARD

A circuit board according to an embodiment includes an insulating layer including an upper surface and a lower surface, and having a via hole passing through the upper surface and the lower surface in a thickness direction from the upper surface to the lower surface, wherein the via hole includes: a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, Dong Sun, NAM, Sang Hyuck, RYU, Sung Wuk
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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