SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER

Nanotwinned copper and non-nanotwinned copper may be electroplated to form mixed crystal structures such as 2-in-1 copper via and RDL structures or 2-in-1 copper via and pillar structures. Nanotwinned copper may be electroplated on a non-nanotwinned copper layer by pretreating a surface of the non-n...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BANIK, II, Stephen J, OBERST, Justin, BUCKALEW, Bryan L, PONNUSWAMY, Thomas Anand, MAYER, Steven T
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!