ACOUSTIC WAVE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER

ACOUSTIC WAVE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER

An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least a pair of comb-shaped electrodes provided on the piezoelectric layer, each of the comb-shaped electrodes including a plurality of electrode fingers, and an insulating layer provide...

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Hauptverfasser: SATO, Koichi, YAMAMOTO, Shinji, NAKAZATO, Toshiharu
Format: Patent
Sprache:eng
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BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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creator SATO, Koichi
YAMAMOTO, Shinji
NAKAZATO, Toshiharu
description An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least a pair of comb-shaped electrodes provided on the piezoelectric layer, each of the comb-shaped electrodes including a plurality of electrode fingers, and an insulating layer provided between the support substrate and the piezoelectric layer, the insulating layer having, in at least a part thereof, a plurality of void regions of which extending directions are different from each other when viewed from a thickness direction of the support substrate, a width in the corresponding extending direction of each of the void regions being longer than a width in a direction orthogonal to the corresponding extending direction when viewed from the thickness direction of the support substrate.
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subjects BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
title ACOUSTIC WAVE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER
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