LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS AND PMOS TRANSISTORS

Complementary metal-oxide-semiconductor (CMOS) devices and methods related to selective metal contacts to n-type and p-type source and drain semiconductors are discussed. A p-type metal is deposited on n- and p-type source/drains. The p-type metal is selectively removed from the n-type source/drains...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Metz, Matthew V, Jezewski, Christopher J
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Metz, Matthew V
Jezewski, Christopher J
description Complementary metal-oxide-semiconductor (CMOS) devices and methods related to selective metal contacts to n-type and p-type source and drain semiconductors are discussed. A p-type metal is deposited on n- and p-type source/drains. The p-type metal is selectively removed from the n-type source/drains but remains on dielectric materials adjacent the n-type source/drains. An n-type metal is deposited on the n-type source/drains while the remaining p-type metal seals the dielectric materials to protect the n-type metal from contamination. The n-type metal is then sealed using another p-type metal. A contact fill material contacts the resultant source and drain contact stacks.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023197823A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023197823A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023197823A13</originalsourceid><addsrcrecordid>eNqNjEEKwjAQRbNxIeodBlwLtllol0My1UCTSGZKl6VIXIkW6v2xBQ_g6r0Hn79WXRM7SMSOBYMh8CTYgERg8s7EYFsjMcFsgkYY6jlcELokFLIQfGTAYOG2iCQMy1NMvFWrx_Cc8u7HjdrXJOZ6yOO7z9M43PMrf_qWy2Opi-p0LjUW-r_VF7ijMlw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS AND PMOS TRANSISTORS</title><source>esp@cenet</source><creator>Metz, Matthew V ; Jezewski, Christopher J</creator><creatorcontrib>Metz, Matthew V ; Jezewski, Christopher J</creatorcontrib><description>Complementary metal-oxide-semiconductor (CMOS) devices and methods related to selective metal contacts to n-type and p-type source and drain semiconductors are discussed. A p-type metal is deposited on n- and p-type source/drains. The p-type metal is selectively removed from the n-type source/drains but remains on dielectric materials adjacent the n-type source/drains. An n-type metal is deposited on the n-type source/drains while the remaining p-type metal seals the dielectric materials to protect the n-type metal from contamination. The n-type metal is then sealed using another p-type metal. A contact fill material contacts the resultant source and drain contact stacks.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230622&amp;DB=EPODOC&amp;CC=US&amp;NR=2023197823A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230622&amp;DB=EPODOC&amp;CC=US&amp;NR=2023197823A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Metz, Matthew V</creatorcontrib><creatorcontrib>Jezewski, Christopher J</creatorcontrib><title>LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS AND PMOS TRANSISTORS</title><description>Complementary metal-oxide-semiconductor (CMOS) devices and methods related to selective metal contacts to n-type and p-type source and drain semiconductors are discussed. A p-type metal is deposited on n- and p-type source/drains. The p-type metal is selectively removed from the n-type source/drains but remains on dielectric materials adjacent the n-type source/drains. An n-type metal is deposited on the n-type source/drains while the remaining p-type metal seals the dielectric materials to protect the n-type metal from contamination. The n-type metal is then sealed using another p-type metal. A contact fill material contacts the resultant source and drain contact stacks.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjEEKwjAQRbNxIeodBlwLtllol0My1UCTSGZKl6VIXIkW6v2xBQ_g6r0Hn79WXRM7SMSOBYMh8CTYgERg8s7EYFsjMcFsgkYY6jlcELokFLIQfGTAYOG2iCQMy1NMvFWrx_Cc8u7HjdrXJOZ6yOO7z9M43PMrf_qWy2Opi-p0LjUW-r_VF7ijMlw</recordid><startdate>20230622</startdate><enddate>20230622</enddate><creator>Metz, Matthew V</creator><creator>Jezewski, Christopher J</creator><scope>EVB</scope></search><sort><creationdate>20230622</creationdate><title>LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS AND PMOS TRANSISTORS</title><author>Metz, Matthew V ; Jezewski, Christopher J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023197823A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Metz, Matthew V</creatorcontrib><creatorcontrib>Jezewski, Christopher J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Metz, Matthew V</au><au>Jezewski, Christopher J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS AND PMOS TRANSISTORS</title><date>2023-06-22</date><risdate>2023</risdate><abstract>Complementary metal-oxide-semiconductor (CMOS) devices and methods related to selective metal contacts to n-type and p-type source and drain semiconductors are discussed. A p-type metal is deposited on n- and p-type source/drains. The p-type metal is selectively removed from the n-type source/drains but remains on dielectric materials adjacent the n-type source/drains. An n-type metal is deposited on the n-type source/drains while the remaining p-type metal seals the dielectric materials to protect the n-type metal from contamination. The n-type metal is then sealed using another p-type metal. A contact fill material contacts the resultant source and drain contact stacks.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2023197823A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS AND PMOS TRANSISTORS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T01%3A29%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Metz,%20Matthew%20V&rft.date=2023-06-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023197823A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true