ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

An electronic package is provided and includes stacking a first packaging module having a circuit structure, an electronic element, a plurality of first conductive elements and a first packaging layer with a second packaging module having a routing structure, a plurality of second conductive element...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Huang, Po-Kai, Ke, Chung-Yu, Chen, Liang-Pin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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