CUTTING APPARATUS
A cutting apparatus for cutting a workpiece includes a chuck table having a holding surface for holding the workpiece thereon, a cutting unit having a spindle with a cutting blade mounted on a distal end thereof for cutting the workpiece held on the holding surface, an image capturing unit for captu...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SAWAKI, Satoshi FUKAZAWA, Takashi |
| description | A cutting apparatus for cutting a workpiece includes a chuck table having a holding surface for holding the workpiece thereon, a cutting unit having a spindle with a cutting blade mounted on a distal end thereof for cutting the workpiece held on the holding surface, an image capturing unit for capturing an image of an outer circumferential portion of the cutting blade mounted on the cutting unit, and a determining section for determining the orientation of the cutting blade. The outer circumferential portion of the cutting blade includes a plurality of protrusions each having a first surface for scraping swarf off from the workpiece when the cutting blade cuts the workpiece and a second surface connected to the first surface. The determining section determines the orientation of the cutting blade mounted on the cutting unit, according to an image captured of the protrusions by the image capturing unit. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023191511A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023191511A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023191511A13</originalsourceid><addsrcrecordid>eNrjZBB0Dg0J8fRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRsaGloamhoaOhsbEqQIApFMezQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CUTTING APPARATUS</title><source>esp@cenet</source><creator>SAWAKI, Satoshi ; FUKAZAWA, Takashi</creator><creatorcontrib>SAWAKI, Satoshi ; FUKAZAWA, Takashi</creatorcontrib><description>A cutting apparatus for cutting a workpiece includes a chuck table having a holding surface for holding the workpiece thereon, a cutting unit having a spindle with a cutting blade mounted on a distal end thereof for cutting the workpiece held on the holding surface, an image capturing unit for capturing an image of an outer circumferential portion of the cutting blade mounted on the cutting unit, and a determining section for determining the orientation of the cutting blade. The outer circumferential portion of the cutting blade includes a plurality of protrusions each having a first surface for scraping swarf off from the workpiece when the cutting blade cuts the workpiece and a second surface connected to the first surface. The determining section determines the orientation of the cutting blade mounted on the cutting unit, according to an image captured of the protrusions by the image capturing unit.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BROACHING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILING ; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PLANING ; SAWING ; SCRAPING ; SEMICONDUCTOR DEVICES ; SHEARING ; SLOTTING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230622&DB=EPODOC&CC=US&NR=2023191511A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230622&DB=EPODOC&CC=US&NR=2023191511A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAWAKI, Satoshi</creatorcontrib><creatorcontrib>FUKAZAWA, Takashi</creatorcontrib><title>CUTTING APPARATUS</title><description>A cutting apparatus for cutting a workpiece includes a chuck table having a holding surface for holding the workpiece thereon, a cutting unit having a spindle with a cutting blade mounted on a distal end thereof for cutting the workpiece held on the holding surface, an image capturing unit for capturing an image of an outer circumferential portion of the cutting blade mounted on the cutting unit, and a determining section for determining the orientation of the cutting blade. The outer circumferential portion of the cutting blade includes a plurality of protrusions each having a first surface for scraping swarf off from the workpiece when the cutting blade cuts the workpiece and a second surface connected to the first surface. The determining section determines the orientation of the cutting blade mounted on the cutting unit, according to an image captured of the protrusions by the image capturing unit.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BROACHING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILING</subject><subject>LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PLANING</subject><subject>SAWING</subject><subject>SCRAPING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHEARING</subject><subject>SLOTTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB0Dg0J8fRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRsaGloamhoaOhsbEqQIApFMezQ</recordid><startdate>20230622</startdate><enddate>20230622</enddate><creator>SAWAKI, Satoshi</creator><creator>FUKAZAWA, Takashi</creator><scope>EVB</scope></search><sort><creationdate>20230622</creationdate><title>CUTTING APPARATUS</title><author>SAWAKI, Satoshi ; FUKAZAWA, Takashi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023191511A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BROACHING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILING</topic><topic>LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PLANING</topic><topic>SAWING</topic><topic>SCRAPING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHEARING</topic><topic>SLOTTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SAWAKI, Satoshi</creatorcontrib><creatorcontrib>FUKAZAWA, Takashi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAWAKI, Satoshi</au><au>FUKAZAWA, Takashi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CUTTING APPARATUS</title><date>2023-06-22</date><risdate>2023</risdate><abstract>A cutting apparatus for cutting a workpiece includes a chuck table having a holding surface for holding the workpiece thereon, a cutting unit having a spindle with a cutting blade mounted on a distal end thereof for cutting the workpiece held on the holding surface, an image capturing unit for capturing an image of an outer circumferential portion of the cutting blade mounted on the cutting unit, and a determining section for determining the orientation of the cutting blade. The outer circumferential portion of the cutting blade includes a plurality of protrusions each having a first surface for scraping swarf off from the workpiece when the cutting blade cuts the workpiece and a second surface connected to the first surface. The determining section determines the orientation of the cutting blade mounted on the cutting unit, according to an image captured of the protrusions by the image capturing unit.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2023191511A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS BROACHING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PLANING SAWING SCRAPING SEMICONDUCTOR DEVICES SHEARING SLOTTING TRANSPORTING |
| title | CUTTING APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T12%3A37%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAWAKI,%20Satoshi&rft.date=2023-06-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023191511A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |