Method for Making Contact with a Component Embedded in a Printed Circuit Board

The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps:Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer,Embedding of at least one component int...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Weidinger, Gerald, Zluc, Andreas, Stahr, Johannes
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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