Housing, Semiconductor Module Comprising a Housing and Method for Producing a Housing

A housing for a power semiconductor module includes sidewalls and a top that includes a first surface extending in a first horizontal plane and a second surface opposite and in parallel to the first surface, a plurality of openings of a first kind, each of the plurality of openings of the first kind...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wolff, Karsten, Nolten, Ulrich
Format: Patent
Sprache:eng
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