METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A method for manufacturing a semiconductor device includes steps (a) to (e). In the step (a), a lead frame including a plurality of lead portions, tie bars, a frame body, and ring portions is prepared. In the step (b), an assembled body is formed. In the step (c), the assembled body is placed in a c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIRASAWA, Takaaki, YOSHIMATSU, Naoki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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