SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

In one example, a packaged electronic device includes a molded substrate. The molded substrate includes a conductive structure having an edge lead with an edge lead outward side and an edge lead inward side opposite to the edge lead outward side, and an inner lead having an inner lead outward side a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JEON, Hyeong Il, ABE, Junichiro, KIM, Byong Jin, KIM, Gi Jeong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!