Molded Silicon on Passive Package

Molded Silicon on Passive Package

Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of pa...

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Hauptverfasser: Shanmugam, Karthik, Camenforte, Raymundo M, Nagarajan, Kumar, Carson, Flynn P, Li, Menglu, Morrison, Scott D
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Shanmugam, Karthik
Camenforte, Raymundo M
Nagarajan, Kumar
Carson, Flynn P
Li, Menglu
Morrison, Scott D
description Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023178458A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023178458A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023178458A13</originalsourceid><addsrcrecordid>eNrjZFD0zc9JSU1RCM7MyUzOz1MAooDE4uLMslQgnZydmJ7Kw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkviQ4ONDIyMDc0tTEwtHA2NiVMFAN4iJhY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Molded Silicon on Passive Package</title><source>esp@cenet</source><creator>Shanmugam, Karthik ; Camenforte, Raymundo M ; Nagarajan, Kumar ; Carson, Flynn P ; Li, Menglu ; Morrison, Scott D</creator><creatorcontrib>Shanmugam, Karthik ; Camenforte, Raymundo M ; Nagarajan, Kumar ; Carson, Flynn P ; Li, Menglu ; Morrison, Scott D</creatorcontrib><description>Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230608&amp;DB=EPODOC&amp;CC=US&amp;NR=2023178458A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230608&amp;DB=EPODOC&amp;CC=US&amp;NR=2023178458A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Shanmugam, Karthik</creatorcontrib><creatorcontrib>Camenforte, Raymundo M</creatorcontrib><creatorcontrib>Nagarajan, Kumar</creatorcontrib><creatorcontrib>Carson, Flynn P</creatorcontrib><creatorcontrib>Li, Menglu</creatorcontrib><creatorcontrib>Morrison, Scott D</creatorcontrib><title>Molded Silicon on Passive Package</title><description>Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD0zc9JSU1RCM7MyUzOz1MAooDE4uLMslQgnZydmJ7Kw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkviQ4ONDIyMDc0tTEwtHA2NiVMFAN4iJhY</recordid><startdate>20230608</startdate><enddate>20230608</enddate><creator>Shanmugam, Karthik</creator><creator>Camenforte, Raymundo M</creator><creator>Nagarajan, Kumar</creator><creator>Carson, Flynn P</creator><creator>Li, Menglu</creator><creator>Morrison, Scott D</creator><scope>EVB</scope></search><sort><creationdate>20230608</creationdate><title>Molded Silicon on Passive Package</title><author>Shanmugam, Karthik ; Camenforte, Raymundo M ; Nagarajan, Kumar ; Carson, Flynn P ; Li, Menglu ; Morrison, Scott D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023178458A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Shanmugam, Karthik</creatorcontrib><creatorcontrib>Camenforte, Raymundo M</creatorcontrib><creatorcontrib>Nagarajan, Kumar</creatorcontrib><creatorcontrib>Carson, Flynn P</creatorcontrib><creatorcontrib>Li, Menglu</creatorcontrib><creatorcontrib>Morrison, Scott D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shanmugam, Karthik</au><au>Camenforte, Raymundo M</au><au>Nagarajan, Kumar</au><au>Carson, Flynn P</au><au>Li, Menglu</au><au>Morrison, Scott D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Molded Silicon on Passive Package</title><date>2023-06-08</date><risdate>2023</risdate><abstract>Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Molded Silicon on Passive Package
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T21%3A10%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Shanmugam,%20Karthik&rft.date=2023-06-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023178458A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true