LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

A liquid ejecting head includes: a sealing substrate provided in such a way as to cover the first piezoelectric element and the second piezoelectric element; a wiring board configured to apply a voltage to a common electrode, a first individual electrode, and a second individual electrode; a first w...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	TAKABE, Motoki
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A liquid ejecting head includes: a sealing substrate provided in such a way as to cover the first piezoelectric element and the second piezoelectric element; a wiring board configured to apply a voltage to a common electrode, a first individual electrode, and a second individual electrode; a first wiring portion provided above the pressure chamber substrate and configured to electrically couple the common electrode to the wiring board; a second wiring portion provided at a lower surface of the sealing substrate and configured to electrically couple the common electrode to the wiring board; and a third wiring portion provided between the first piezoelectric element and the second piezoelectric element and configured to electrically couple the first wiring portion to the second wiring portion.