Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells

A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers directly above a conductor tier. Strings of memory cells comprise channel-material strings that extend thro...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Venigalla, Rajasekhar, Lomeli, Nancy M
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Venigalla, Rajasekhar
Lomeli, Nancy M
description A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers directly above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers. The channel-material strings directly electrically couple with conductor material of the conductor tier. A through-array-via (TAV) region comprises TAVs that individually extend through the insulative tiers and the conductive tiers into the conductor tier. Individual of the TAVs comprise an upper portion directly above and joined with a lower portion. The individual TAVs comprise at least one external jog surface in a vertical cross-section where the upper and lower portions join. The lower portion is wider in the vertical cross-section than the upper portion where the upper and lower portions join. Other embodiments, including method, are disclosed.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023170024A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023170024A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023170024A13</originalsourceid><addsrcrecordid>eNrjZKjzTc3NL6pUcCwqSqwsVnDOzy0oyizOzEtXCC4pAlLFCv5pClA1zqk5OcUKjnkpQIGSjPyUYoXQ4tQUBc88Bbf8olyQHkcFZOOIMI2HgTUtMac4lRdKczMou7mGOHvophbkx6cWFyQmp-allsSHBhsZGBkbmhsYGJk4GhoTpwoArS1HlA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells</title><source>esp@cenet</source><creator>Venigalla, Rajasekhar ; Lomeli, Nancy M</creator><creatorcontrib>Venigalla, Rajasekhar ; Lomeli, Nancy M</creatorcontrib><description>A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers directly above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers. The channel-material strings directly electrically couple with conductor material of the conductor tier. A through-array-via (TAV) region comprises TAVs that individually extend through the insulative tiers and the conductive tiers into the conductor tier. Individual of the TAVs comprise an upper portion directly above and joined with a lower portion. The individual TAVs comprise at least one external jog surface in a vertical cross-section where the upper and lower portions join. The lower portion is wider in the vertical cross-section than the upper portion where the upper and lower portions join. Other embodiments, including method, are disclosed.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INFORMATION STORAGE ; PHYSICS ; SEMICONDUCTOR DEVICES ; STATIC STORES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230601&amp;DB=EPODOC&amp;CC=US&amp;NR=2023170024A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230601&amp;DB=EPODOC&amp;CC=US&amp;NR=2023170024A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Venigalla, Rajasekhar</creatorcontrib><creatorcontrib>Lomeli, Nancy M</creatorcontrib><title>Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells</title><description>A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers directly above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers. The channel-material strings directly electrically couple with conductor material of the conductor tier. A through-array-via (TAV) region comprises TAVs that individually extend through the insulative tiers and the conductive tiers into the conductor tier. Individual of the TAVs comprise an upper portion directly above and joined with a lower portion. The individual TAVs comprise at least one external jog surface in a vertical cross-section where the upper and lower portions join. The lower portion is wider in the vertical cross-section than the upper portion where the upper and lower portions join. Other embodiments, including method, are disclosed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INFORMATION STORAGE</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STATIC STORES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZKjzTc3NL6pUcCwqSqwsVnDOzy0oyizOzEtXCC4pAlLFCv5pClA1zqk5OcUKjnkpQIGSjPyUYoXQ4tQUBc88Bbf8olyQHkcFZOOIMI2HgTUtMac4lRdKczMou7mGOHvophbkx6cWFyQmp-allsSHBhsZGBkbmhsYGJk4GhoTpwoArS1HlA</recordid><startdate>20230601</startdate><enddate>20230601</enddate><creator>Venigalla, Rajasekhar</creator><creator>Lomeli, Nancy M</creator><scope>EVB</scope></search><sort><creationdate>20230601</creationdate><title>Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells</title><author>Venigalla, Rajasekhar ; Lomeli, Nancy M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023170024A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INFORMATION STORAGE</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STATIC STORES</topic><toplevel>online_resources</toplevel><creatorcontrib>Venigalla, Rajasekhar</creatorcontrib><creatorcontrib>Lomeli, Nancy M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Venigalla, Rajasekhar</au><au>Lomeli, Nancy M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells</title><date>2023-06-01</date><risdate>2023</risdate><abstract>A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers directly above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers. The channel-material strings directly electrically couple with conductor material of the conductor tier. A through-array-via (TAV) region comprises TAVs that individually extend through the insulative tiers and the conductive tiers into the conductor tier. Individual of the TAVs comprise an upper portion directly above and joined with a lower portion. The individual TAVs comprise at least one external jog surface in a vertical cross-section where the upper and lower portions join. The lower portion is wider in the vertical cross-section than the upper portion where the upper and lower portions join. Other embodiments, including method, are disclosed.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2023170024A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
title Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-30T15%3A35%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Venigalla,%20Rajasekhar&rft.date=2023-06-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023170024A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true