LIQUID COOLING HEAT DISSIPATION SUBSTRATE STRUCTURE WITH PARTIAL COMPRESSION REINFORCEMENT

A liquid cooling heat dissipation substrate structure with partial compression reinforcement is provided. The liquid cooling heat dissipation substrate structure with partial compression reinforcement includes a heat dissipation base that integrally has a heat dissipation main structure and a compre...

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Bibliographische Detailangaben
Hauptverfasser:	PENG, CHENG-SHU, LIN, YENUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A liquid cooling heat dissipation substrate structure with partial compression reinforcement is provided. The liquid cooling heat dissipation substrate structure with partial compression reinforcement includes a heat dissipation base that integrally has a heat dissipation main structure and a compression reinforcement structure. The heat dissipation main structure and the compression reinforcement structure are formed through different processes. The heat dissipation main structure and the compression reinforcement structure have different metallographic microstructures. Crystallites of the metallographic microstructure of the heat dissipation main structure are not all arranged in one specific direction, and crystallites of the metallographic microstructure of the compression reinforcement structure are stacked and arranged in a direction that is perpendicular to a compression direction.