NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICONDUCTOR APPLICATIONS
A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.
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creator | Luce, Andrew M Armiento, Craig A Piro, Yuri Kingsley, Edward D Kuncho, Christopher N Ranasingha, Oshadha Areias, Christopher R Lamport, Emily Akyurtlu, Alkim |
description | A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023139276A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023139276A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023139276A13</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAuDqL-Q8BZsC0oHc_rFQ_SXEkudSxF4iRaqP-PCn6A01veMusdOEFpOwmsZFpQ8gzWNOJNtOqhZ7GkBqOHkyVTsydUc_HfHahlFFdH1E-HrrOMoCwurLPFbbzPafNzlW0bUjzv0vQc0jyN1_RIryGGYl-UeVkVxwPk5X_rDaxaMlE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICONDUCTOR APPLICATIONS</title><source>esp@cenet</source><creator>Luce, Andrew M ; Armiento, Craig A ; Piro, Yuri ; Kingsley, Edward D ; Kuncho, Christopher N ; Ranasingha, Oshadha ; Areias, Christopher R ; Lamport, Emily ; Akyurtlu, Alkim</creator><creatorcontrib>Luce, Andrew M ; Armiento, Craig A ; Piro, Yuri ; Kingsley, Edward D ; Kuncho, Christopher N ; Ranasingha, Oshadha ; Areias, Christopher R ; Lamport, Emily ; Akyurtlu, Alkim</creatorcontrib><description>A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.</description><language>eng</language><subject>ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230504&DB=EPODOC&CC=US&NR=2023139276A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230504&DB=EPODOC&CC=US&NR=2023139276A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Luce, Andrew M</creatorcontrib><creatorcontrib>Armiento, Craig A</creatorcontrib><creatorcontrib>Piro, Yuri</creatorcontrib><creatorcontrib>Kingsley, Edward D</creatorcontrib><creatorcontrib>Kuncho, Christopher N</creatorcontrib><creatorcontrib>Ranasingha, Oshadha</creatorcontrib><creatorcontrib>Areias, Christopher R</creatorcontrib><creatorcontrib>Lamport, Emily</creatorcontrib><creatorcontrib>Akyurtlu, Alkim</creatorcontrib><title>NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICONDUCTOR APPLICATIONS</title><description>A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.</description><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAuDqL-Q8BZsC0oHc_rFQ_SXEkudSxF4iRaqP-PCn6A01veMusdOEFpOwmsZFpQ8gzWNOJNtOqhZ7GkBqOHkyVTsydUc_HfHahlFFdH1E-HrrOMoCwurLPFbbzPafNzlW0bUjzv0vQc0jyN1_RIryGGYl-UeVkVxwPk5X_rDaxaMlE</recordid><startdate>20230504</startdate><enddate>20230504</enddate><creator>Luce, Andrew M</creator><creator>Armiento, Craig A</creator><creator>Piro, Yuri</creator><creator>Kingsley, Edward D</creator><creator>Kuncho, Christopher N</creator><creator>Ranasingha, Oshadha</creator><creator>Areias, Christopher R</creator><creator>Lamport, Emily</creator><creator>Akyurtlu, Alkim</creator><scope>EVB</scope></search><sort><creationdate>20230504</creationdate><title>NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICONDUCTOR APPLICATIONS</title><author>Luce, Andrew M ; Armiento, Craig A ; Piro, Yuri ; Kingsley, Edward D ; Kuncho, Christopher N ; Ranasingha, Oshadha ; Areias, Christopher R ; Lamport, Emily ; Akyurtlu, Alkim</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023139276A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>Luce, Andrew M</creatorcontrib><creatorcontrib>Armiento, Craig A</creatorcontrib><creatorcontrib>Piro, Yuri</creatorcontrib><creatorcontrib>Kingsley, Edward D</creatorcontrib><creatorcontrib>Kuncho, Christopher N</creatorcontrib><creatorcontrib>Ranasingha, Oshadha</creatorcontrib><creatorcontrib>Areias, Christopher R</creatorcontrib><creatorcontrib>Lamport, Emily</creatorcontrib><creatorcontrib>Akyurtlu, Alkim</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Luce, Andrew M</au><au>Armiento, Craig A</au><au>Piro, Yuri</au><au>Kingsley, Edward D</au><au>Kuncho, Christopher N</au><au>Ranasingha, Oshadha</au><au>Areias, Christopher R</au><au>Lamport, Emily</au><au>Akyurtlu, Alkim</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICONDUCTOR APPLICATIONS</title><date>2023-05-04</date><risdate>2023</risdate><abstract>A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS USE OF MATERIALS THEREFOR WOODSTAINS |
title | NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICONDUCTOR APPLICATIONS |
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