SEMICONDUCTOR PACKAGE

A semiconductor package is provided. The semiconductor package includes: a substrate; a first semiconductor chip provided on an upper surface of the substrate; an interposer provided on the first semiconductor chip; a conductive pad provided on the upper surface of the substrate; and a connecting po...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, Jae-Ean, CHOI, Gyu Jin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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