FILM DEPOSITION APPARATUS

A film deposition apparatus according to an embodiment is a film deposition apparatus including a depressurized processing vessel in which a film deposition chamber and a cooling chamber communicating with the film deposition chamber are provided, the film deposition chamber being configured to perf...

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1. Verfasser: SATO, Takayasu
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creator SATO, Takayasu
description A film deposition apparatus according to an embodiment is a film deposition apparatus including a depressurized processing vessel in which a film deposition chamber and a cooling chamber communicating with the film deposition chamber are provided, the film deposition chamber being configured to perform vacuum deposition on a substrate, the cooling chamber being configured to cool the substrate. The cooling chamber includes a passage through which the substrate moves, and a cooling device placed on an inner wall of the processing vessel, the cooling device including a surface-area expansion structure portion facing the passage and a refrigerant passage for refrigerant. The surface-area expansion structure portion includes a plurality of projecting portions provided to project toward the passage from the inner wall of the processing vessel. The refrigerant passage is formed along the projecting portions.
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The cooling chamber includes a passage through which the substrate moves, and a cooling device placed on an inner wall of the processing vessel, the cooling device including a surface-area expansion structure portion facing the passage and a refrigerant passage for refrigerant. The surface-area expansion structure portion includes a plurality of projecting portions provided to project toward the passage from the inner wall of the processing vessel. 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The cooling chamber includes a passage through which the substrate moves, and a cooling device placed on an inner wall of the processing vessel, the cooling device including a surface-area expansion structure portion facing the passage and a refrigerant passage for refrigerant. The surface-area expansion structure portion includes a plurality of projecting portions provided to project toward the passage from the inner wall of the processing vessel. The refrigerant passage is formed along the projecting portions.</abstract><oa>free_for_read</oa></addata></record>
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title FILM DEPOSITION APPARATUS
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