Solder Alloy, Solder Paste, Solder Ball, Solder Preform, and Solder Joint

Provided are a solder alloy, a solder paste, a solder ball, a solder preform, and a solder joint, which have a melting temperature within a predetermined range, and high tensile strength and shear strength, suppress generation of voids, and have excellent mountability due to their thin oxide films....

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Bibliographische Detailangaben
Hauptverfasser:	Tachibana, Yoshie, Horie, Ryuki
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided are a solder alloy, a solder paste, a solder ball, a solder preform, and a solder joint, which have a melting temperature within a predetermined range, and high tensile strength and shear strength, suppress generation of voids, and have excellent mountability due to their thin oxide films. The solder alloy has an alloy composition consisting of, by mass %, Ag: 2.5 to 3.7%, Cu: 0.25 to 0.95%, Bi: 3.0 to 3.9%, and In: 0.5 to 2.3%, with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 8.1≤Ag+2Cu+Bi+In ≤11.5 (1), and 1.00≤(Bi+In)/Ag≤1.66 (2). Ag, Cu, Bi and In in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.