CO-PACKAGED INTEGRATED OPTOELECTRONIC MODULE AND CO-PACKAGED OPTOELECTRONIC SWITCH CHIP

Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically conne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAO, Min-Sheng, YAN, QianBing, WU, Chien-Tzu, FU, Chung-Hsin, YU, Chih-Wei, LIN, Yi-Tseng, LI, LinChun, WU, ChunFu
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS TRANSMISSION
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