SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF

Disclosed are semiconductor packages and thermal management methods thereof. The semiconductor package includes an upper semiconductor chip; and a lower semiconductor chip connected via a plurality of through electrodes to the upper semiconductor chip. The lower semiconductor chip may include at lea...

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1. Verfasser:	LEE, Jungpil
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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creator	LEE, Jungpil
description	Disclosed are semiconductor packages and thermal management methods thereof. The semiconductor package includes an upper semiconductor chip; and a lower semiconductor chip connected via a plurality of through electrodes to the upper semiconductor chip. The lower semiconductor chip may include at least one temperature sensor configured to sense a temperature of the upper semiconductor chip, a power control unit connected to the at least one temperature sensor, a power switching element connected to at least a first one of the plurality of through electrodes, and a clock control element connected to at least a second one of the plurality of through electrodes.
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subjects	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF
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