Semiconductor Device and Method of Forming RDL Hybrid Interposer Substrate

A semiconductor device has a first substrate and a first electrical component disposed over the first substrate. The first electrical component has a second substrate, and redistribution layer formed over the second substrate. The first electrical component is disposed over the redistribution layer....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim, JongTae, Choi, HaengCheol, Cho, NamJu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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