SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

A method of packaging a semiconductor device includes: bonding a ball at an end of a bond wire to a bond pad of a semiconductor device die in an aperture of a shielding layer of the semiconductor device; and sealing the part of the bond pad exposed by the aperture of the shielding layer by deforming...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ge, You, Wang, Zhijie, Lye, Meng Kong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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