HEAT EXCHANGE ASSEMBLY

A heat exchange assembly includes a plate stack having fin plates and spacer plates interleaved with the fin plates in the plate stack. Each fin plate has fin sides extending between a fin lower edge and a fin upper edge. Each spacer plate has spacer sides extending between a spacer lower edge and a...

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description A heat exchange assembly includes a plate stack having fin plates and spacer plates interleaved with the fin plates in the plate stack. Each fin plate has fin sides extending between a fin lower edge and a fin upper edge. Each spacer plate has spacer sides extending between a spacer lower edge and a spacer upper edge. The fin upper edges of the fin plates are located above the spacer upper edges. Air flow channels are formed in gaps between the fin plates above the spacer plates. The fin lower edges and the spacer lower edges define a lower thermal interface configured to be in thermal communication with an electrical component to dissipate heat from the electrical component. The fin plates are independently movable relative to the spacer plates in the plate stack to independently articulate the fin lower edges and the spacer lower edges at the lower thermal interface. The heat exchange assembly includes a plate stabilizer structure positioning the fin upper edges relative to each other. The plate stabilizer structure includes plate stabilizers having stabilizing fingers. The stabilizing fingers coupled to at least two fin plates to control spacing of the fin upper edges of the corresponding fin plates.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023102497A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023102497A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023102497A13</originalsourceid><addsrcrecordid>eNrjZBDzcHUMUXCNcPZw9HN3VXAMDnb1dfKJ5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGxoYGRiaW5o6GxsSpAgAjax_y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT EXCHANGE ASSEMBLY</title><source>esp@cenet</source><creator>Sharf, Alex Michael</creator><creatorcontrib>Sharf, Alex Michael</creatorcontrib><description>A heat exchange assembly includes a plate stack having fin plates and spacer plates interleaved with the fin plates in the plate stack. Each fin plate has fin sides extending between a fin lower edge and a fin upper edge. Each spacer plate has spacer sides extending between a spacer lower edge and a spacer upper edge. The fin upper edges of the fin plates are located above the spacer upper edges. Air flow channels are formed in gaps between the fin plates above the spacer plates. The fin lower edges and the spacer lower edges define a lower thermal interface configured to be in thermal communication with an electrical component to dissipate heat from the electrical component. The fin plates are independently movable relative to the spacer plates in the plate stack to independently articulate the fin lower edges and the spacer lower edges at the lower thermal interface. The heat exchange assembly includes a plate stabilizer structure positioning the fin upper edges relative to each other. The plate stabilizer structure includes plate stabilizers having stabilizing fingers. The stabilizing fingers coupled to at least two fin plates to control spacing of the fin upper edges of the corresponding fin plates.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230330&amp;DB=EPODOC&amp;CC=US&amp;NR=2023102497A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76304</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230330&amp;DB=EPODOC&amp;CC=US&amp;NR=2023102497A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Sharf, Alex Michael</creatorcontrib><title>HEAT EXCHANGE ASSEMBLY</title><description>A heat exchange assembly includes a plate stack having fin plates and spacer plates interleaved with the fin plates in the plate stack. Each fin plate has fin sides extending between a fin lower edge and a fin upper edge. Each spacer plate has spacer sides extending between a spacer lower edge and a spacer upper edge. The fin upper edges of the fin plates are located above the spacer upper edges. Air flow channels are formed in gaps between the fin plates above the spacer plates. The fin lower edges and the spacer lower edges define a lower thermal interface configured to be in thermal communication with an electrical component to dissipate heat from the electrical component. The fin plates are independently movable relative to the spacer plates in the plate stack to independently articulate the fin lower edges and the spacer lower edges at the lower thermal interface. The heat exchange assembly includes a plate stabilizer structure positioning the fin upper edges relative to each other. The plate stabilizer structure includes plate stabilizers having stabilizing fingers. The stabilizing fingers coupled to at least two fin plates to control spacing of the fin upper edges of the corresponding fin plates.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDzcHUMUXCNcPZw9HN3VXAMDnb1dfKJ5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGxoYGRiaW5o6GxsSpAgAjax_y</recordid><startdate>20230330</startdate><enddate>20230330</enddate><creator>Sharf, Alex Michael</creator><scope>EVB</scope></search><sort><creationdate>20230330</creationdate><title>HEAT EXCHANGE ASSEMBLY</title><author>Sharf, Alex Michael</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023102497A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Sharf, Alex Michael</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sharf, Alex Michael</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT EXCHANGE ASSEMBLY</title><date>2023-03-30</date><risdate>2023</risdate><abstract>A heat exchange assembly includes a plate stack having fin plates and spacer plates interleaved with the fin plates in the plate stack. Each fin plate has fin sides extending between a fin lower edge and a fin upper edge. Each spacer plate has spacer sides extending between a spacer lower edge and a spacer upper edge. The fin upper edges of the fin plates are located above the spacer upper edges. Air flow channels are formed in gaps between the fin plates above the spacer plates. The fin lower edges and the spacer lower edges define a lower thermal interface configured to be in thermal communication with an electrical component to dissipate heat from the electrical component. The fin plates are independently movable relative to the spacer plates in the plate stack to independently articulate the fin lower edges and the spacer lower edges at the lower thermal interface. The heat exchange assembly includes a plate stabilizer structure positioning the fin upper edges relative to each other. The plate stabilizer structure includes plate stabilizers having stabilizing fingers. The stabilizing fingers coupled to at least two fin plates to control spacing of the fin upper edges of the corresponding fin plates.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title HEAT EXCHANGE ASSEMBLY
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T12%3A36%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Sharf,%20Alex%20Michael&rft.date=2023-03-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023102497A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true