SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS

A semiconductor package is disclosed. The package includes a sensor die which is disposed on a package substrate. A cover structure is attached to a cover adhesive surrounding the sensor die, forming a cavity above the sensor die. The cover structure includes a primary cover structure and a secondar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIM, Il Kwon, PUNZALAN, Jeffrey
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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