CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING A CHIP PACKAGE STRUCTURE

A chip package structure is disclosed. In one example, the chip package may include a chip, an encapsulation material, and an exposed pad that is electrically conductively connected to the chip. A layer of a porous or dendrite-comprising adhesion promoter is on a surface of the exposed pad. A therma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUERGUT, Edward, MAYER, Martin, KAN, Chan Whai Augustine, RIEDL, Edmund, SAX, Harry Walter
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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