CONTACT AND VIA STRUCTURES

An exemplary semiconductor device includes a substrate, a first conductive feature, a second conductive feature, and a third conductive feature over the substrate. The first conductive feature has a first top surface and a side surface. The third conductive feature is on the first top surface of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chen, Jyh-Huei, Tsai, Kuo-Chiang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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