TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY DEVICE
A semiconductor device includes a memory region including an array of memory cell devices, and a test region including a test memory cell structure. The test memory cell structure includes a first gate stack on a first raised portion of a substrate, a first polysilicon structure adjacent to the firs...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | LIAO, Ken-Ying SUNG, Chih-Wei TUNG, Huai-jen LIN, Tzu-Pin CHEN, Po-Zen YANG, Yung-Lung WU, Yen-Jou |
description | A semiconductor device includes a memory region including an array of memory cell devices, and a test region including a test memory cell structure. The test memory cell structure includes a first gate stack on a first raised portion of a substrate, a first polysilicon structure adjacent to the first raised portion and in a region between the first raised portion and a second raised portion of the substrate, a first spacer adjacent to the first polysilicon structure, and a second gate stack on the second raised portion, a second polysilicon structure adjacent to the second raised portion and in the region between the first raised portion and the second raised portion, and a second spacer adjacent to the second polysilicon structure. The semiconductor device includes an interlayer dielectric layer over at least a portion of the memory region and at least a portion of the test region. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023062401A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023062401A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023062401A13</originalsourceid><addsrcrecordid>eNqNyrsKwjAUANAsDqL-wwVnIU3FPeTRRExuSW4KnUqROIkW6v_j4gc4neVs2ZVMJsiUiqKSDFhMMKDXIKMGwh67JHs3QsDoCZOPHfgIEuxNZgfBBEwjaDN4ZfZs85ifaz383LGjNaTcqS7vqa7LfK-v-plKFly0_CLOvJFN-9_6AiT0Lkw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY DEVICE</title><source>esp@cenet</source><creator>LIAO, Ken-Ying ; SUNG, Chih-Wei ; TUNG, Huai-jen ; LIN, Tzu-Pin ; CHEN, Po-Zen ; YANG, Yung-Lung ; WU, Yen-Jou</creator><creatorcontrib>LIAO, Ken-Ying ; SUNG, Chih-Wei ; TUNG, Huai-jen ; LIN, Tzu-Pin ; CHEN, Po-Zen ; YANG, Yung-Lung ; WU, Yen-Jou</creatorcontrib><description>A semiconductor device includes a memory region including an array of memory cell devices, and a test region including a test memory cell structure. The test memory cell structure includes a first gate stack on a first raised portion of a substrate, a first polysilicon structure adjacent to the first raised portion and in a region between the first raised portion and a second raised portion of the substrate, a first spacer adjacent to the first polysilicon structure, and a second gate stack on the second raised portion, a second polysilicon structure adjacent to the second raised portion and in the region between the first raised portion and the second raised portion, and a second spacer adjacent to the second polysilicon structure. The semiconductor device includes an interlayer dielectric layer over at least a portion of the memory region and at least a portion of the test region.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230302&DB=EPODOC&CC=US&NR=2023062401A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230302&DB=EPODOC&CC=US&NR=2023062401A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIAO, Ken-Ying</creatorcontrib><creatorcontrib>SUNG, Chih-Wei</creatorcontrib><creatorcontrib>TUNG, Huai-jen</creatorcontrib><creatorcontrib>LIN, Tzu-Pin</creatorcontrib><creatorcontrib>CHEN, Po-Zen</creatorcontrib><creatorcontrib>YANG, Yung-Lung</creatorcontrib><creatorcontrib>WU, Yen-Jou</creatorcontrib><title>TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY DEVICE</title><description>A semiconductor device includes a memory region including an array of memory cell devices, and a test region including a test memory cell structure. The test memory cell structure includes a first gate stack on a first raised portion of a substrate, a first polysilicon structure adjacent to the first raised portion and in a region between the first raised portion and a second raised portion of the substrate, a first spacer adjacent to the first polysilicon structure, and a second gate stack on the second raised portion, a second polysilicon structure adjacent to the second raised portion and in the region between the first raised portion and the second raised portion, and a second spacer adjacent to the second polysilicon structure. The semiconductor device includes an interlayer dielectric layer over at least a portion of the memory region and at least a portion of the test region.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrsKwjAUANAsDqL-wwVnIU3FPeTRRExuSW4KnUqROIkW6v_j4gc4neVs2ZVMJsiUiqKSDFhMMKDXIKMGwh67JHs3QsDoCZOPHfgIEuxNZgfBBEwjaDN4ZfZs85ifaz383LGjNaTcqS7vqa7LfK-v-plKFly0_CLOvJFN-9_6AiT0Lkw</recordid><startdate>20230302</startdate><enddate>20230302</enddate><creator>LIAO, Ken-Ying</creator><creator>SUNG, Chih-Wei</creator><creator>TUNG, Huai-jen</creator><creator>LIN, Tzu-Pin</creator><creator>CHEN, Po-Zen</creator><creator>YANG, Yung-Lung</creator><creator>WU, Yen-Jou</creator><scope>EVB</scope></search><sort><creationdate>20230302</creationdate><title>TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY DEVICE</title><author>LIAO, Ken-Ying ; SUNG, Chih-Wei ; TUNG, Huai-jen ; LIN, Tzu-Pin ; CHEN, Po-Zen ; YANG, Yung-Lung ; WU, Yen-Jou</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023062401A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIAO, Ken-Ying</creatorcontrib><creatorcontrib>SUNG, Chih-Wei</creatorcontrib><creatorcontrib>TUNG, Huai-jen</creatorcontrib><creatorcontrib>LIN, Tzu-Pin</creatorcontrib><creatorcontrib>CHEN, Po-Zen</creatorcontrib><creatorcontrib>YANG, Yung-Lung</creatorcontrib><creatorcontrib>WU, Yen-Jou</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIAO, Ken-Ying</au><au>SUNG, Chih-Wei</au><au>TUNG, Huai-jen</au><au>LIN, Tzu-Pin</au><au>CHEN, Po-Zen</au><au>YANG, Yung-Lung</au><au>WU, Yen-Jou</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY DEVICE</title><date>2023-03-02</date><risdate>2023</risdate><abstract>A semiconductor device includes a memory region including an array of memory cell devices, and a test region including a test memory cell structure. The test memory cell structure includes a first gate stack on a first raised portion of a substrate, a first polysilicon structure adjacent to the first raised portion and in a region between the first raised portion and a second raised portion of the substrate, a first spacer adjacent to the first polysilicon structure, and a second gate stack on the second raised portion, a second polysilicon structure adjacent to the second raised portion and in the region between the first raised portion and the second raised portion, and a second spacer adjacent to the second polysilicon structure. The semiconductor device includes an interlayer dielectric layer over at least a portion of the memory region and at least a portion of the test region.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US2023062401A1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY DEVICE |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T04%3A31%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIAO,%20Ken-Ying&rft.date=2023-03-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023062401A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |