Sidewall Connections and Button Interconnects for Molded SiPs
Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect ex...
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| creator | Hoang, Lan H Kani, Bilal Mohamed Ibrahim Ergun, Ali N Kindlon, David M Grena, Benjamin J Vadeentavida, Manoj Renjan, Kishore N Kim, Kyusang |
| description | Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer. |
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In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.</description><language>eng</language><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ; BASIC ELECTRIC ELEMENTS ; CURRENT COLLECTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MEASURING ; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE ; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR ; PHYSICS ; SEMICONDUCTOR DEVICES ; TARIFF METERING APPARATUS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230223&DB=EPODOC&CC=US&NR=2023056922A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230223&DB=EPODOC&CC=US&NR=2023056922A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hoang, Lan H</creatorcontrib><creatorcontrib>Kani, Bilal Mohamed Ibrahim</creatorcontrib><creatorcontrib>Ergun, Ali N</creatorcontrib><creatorcontrib>Kindlon, David M</creatorcontrib><creatorcontrib>Grena, Benjamin J</creatorcontrib><creatorcontrib>Vadeentavida, Manoj</creatorcontrib><creatorcontrib>Renjan, Kishore N</creatorcontrib><creatorcontrib>Kim, Kyusang</creatorcontrib><title>Sidewall Connections and Button Interconnects for Molded SiPs</title><description>Electronic modules and methods of fabrication are described. 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In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING |
| title | Sidewall Connections and Button Interconnects for Molded SiPs |
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