CMP POLISHING LIQUID AND POLISHING METHOD

An aspect of the present disclosure provides a CMP polishing liquid containing: abrasive grains; and a cationic polymer, in which the cationic polymer has a main chain containing a nitrogen atom and a carbon atom and a hydroxyl group bonded to the carbon atom. The CMP polishing liquid may further co...

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Bibliographische Detailangaben
Hauptverfasser: MINAMI, Hisataka, KOBAYASHI, Shingo, WU, Jenna, TAKAHASHI, Hisato, KOMINE, Mayumi, OTSUKA, Yuya
Format: Patent
Sprache:eng
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