CMP POLISHING LIQUID AND POLISHING METHOD

An aspect of the present disclosure provides a CMP polishing liquid containing: abrasive grains; and a cationic polymer, in which the cationic polymer has a main chain containing a nitrogen atom and a carbon atom and a hydroxyl group bonded to the carbon atom. The CMP polishing liquid may further co...

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Hauptverfasser:	MINAMI, Hisataka, KOBAYASHI, Shingo, WU, Jenna, TAKAHASHI, Hisato, KOMINE, Mayumi, OTSUKA, Yuya
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES
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creator	MINAMI, Hisataka KOBAYASHI, Shingo WU, Jenna TAKAHASHI, Hisato KOMINE, Mayumi OTSUKA, Yuya
description	An aspect of the present disclosure provides a CMP polishing liquid containing: abrasive grains; and a cationic polymer, in which the cationic polymer has a main chain containing a nitrogen atom and a carbon atom and a hydroxyl group bonded to the carbon atom. The CMP polishing liquid may further contain at least one cyclic compound selected from the group consisting of an amino group-containing aromatic compound and a nitrogen-containing heterocyclic compound. Another aspect of the present disclosure provides a polishing method including a step of polishing a material to be polished by using this CMP polishing liquid.
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subjects	ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES
title	CMP POLISHING LIQUID AND POLISHING METHOD
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