SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT

The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The fi...

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Hauptverfasser: KNOLL, Oliver, HOFER, Georg, WIRNSBERGER, Thomas, SCHRÖDER, Raoul, ÖTZLINGER, Herbert, GLEISSNER, Andreas, GERSDORFF, Markus
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creator KNOLL, Oliver
HOFER, Georg
WIRNSBERGER, Thomas
SCHRÖDER, Raoul
ÖTZLINGER, Herbert
GLEISSNER, Andreas
GERSDORFF, Markus
description The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023053226A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023053226A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023053226A13</originalsourceid><addsrcrecordid>eNqNikEKwjAQRbtxIeodBlyLNcXu43Rig2kDmQnSVSkSV6KFen-04AFc_fd4f5ldOZ5YghaC2rvKtmfQbQXO42Vm7lioAeMDYE2NRe3mvv86OUIJ3nViETgGo5FAAmlpqJV1trgPjyltfrvKtoYE610aX32axuGWnundR1a5KvJjoVSpD8V_rw-PSTH1</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT</title><source>esp@cenet</source><creator>KNOLL, Oliver ; HOFER, Georg ; WIRNSBERGER, Thomas ; SCHRÖDER, Raoul ; ÖTZLINGER, Herbert ; GLEISSNER, Andreas ; GERSDORFF, Markus</creator><creatorcontrib>KNOLL, Oliver ; HOFER, Georg ; WIRNSBERGER, Thomas ; SCHRÖDER, Raoul ; ÖTZLINGER, Herbert ; GLEISSNER, Andreas ; GERSDORFF, Markus</creatorcontrib><description>The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230216&amp;DB=EPODOC&amp;CC=US&amp;NR=2023053226A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230216&amp;DB=EPODOC&amp;CC=US&amp;NR=2023053226A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KNOLL, Oliver</creatorcontrib><creatorcontrib>HOFER, Georg</creatorcontrib><creatorcontrib>WIRNSBERGER, Thomas</creatorcontrib><creatorcontrib>SCHRÖDER, Raoul</creatorcontrib><creatorcontrib>ÖTZLINGER, Herbert</creatorcontrib><creatorcontrib>GLEISSNER, Andreas</creatorcontrib><creatorcontrib>GERSDORFF, Markus</creatorcontrib><title>SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT</title><description>The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQRbtxIeodBlyLNcXu43Rig2kDmQnSVSkSV6KFen-04AFc_fd4f5ldOZ5YghaC2rvKtmfQbQXO42Vm7lioAeMDYE2NRe3mvv86OUIJ3nViETgGo5FAAmlpqJV1trgPjyltfrvKtoYE610aX32axuGWnundR1a5KvJjoVSpD8V_rw-PSTH1</recordid><startdate>20230216</startdate><enddate>20230216</enddate><creator>KNOLL, Oliver</creator><creator>HOFER, Georg</creator><creator>WIRNSBERGER, Thomas</creator><creator>SCHRÖDER, Raoul</creator><creator>ÖTZLINGER, Herbert</creator><creator>GLEISSNER, Andreas</creator><creator>GERSDORFF, Markus</creator><scope>EVB</scope></search><sort><creationdate>20230216</creationdate><title>SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT</title><author>KNOLL, Oliver ; HOFER, Georg ; WIRNSBERGER, Thomas ; SCHRÖDER, Raoul ; ÖTZLINGER, Herbert ; GLEISSNER, Andreas ; GERSDORFF, Markus</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023053226A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>KNOLL, Oliver</creatorcontrib><creatorcontrib>HOFER, Georg</creatorcontrib><creatorcontrib>WIRNSBERGER, Thomas</creatorcontrib><creatorcontrib>SCHRÖDER, Raoul</creatorcontrib><creatorcontrib>ÖTZLINGER, Herbert</creatorcontrib><creatorcontrib>GLEISSNER, Andreas</creatorcontrib><creatorcontrib>GERSDORFF, Markus</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KNOLL, Oliver</au><au>HOFER, Georg</au><au>WIRNSBERGER, Thomas</au><au>SCHRÖDER, Raoul</au><au>ÖTZLINGER, Herbert</au><au>GLEISSNER, Andreas</au><au>GERSDORFF, Markus</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT</title><date>2023-02-16</date><risdate>2023</risdate><abstract>The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T17%3A17%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KNOLL,%20Oliver&rft.date=2023-02-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023053226A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true