Component Carrier and Method of Manufacturing a Component Carrier
A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically in...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SATTLER, Sebastian VOCKENBERGER, Christian ALOTHMAN ALTERKAWI, Ahmad Bader |
| description | A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023044122A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023044122A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023044122A13</originalsourceid><addsrcrecordid>eNrjZHB0zs8tyM9LzStRcE4sKspMLVJIzEtR8E0tychPUchPU_BNzCtNS0wuKS3KzEtXSFTAUM_DwJqWmFOcyguluRmU3VxDnD10Uwvy41OLCxKTU_NSS-JDg40MjIwNTEwMjYwcDY2JUwUAktsyGA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Component Carrier and Method of Manufacturing a Component Carrier</title><source>esp@cenet</source><creator>SATTLER, Sebastian ; VOCKENBERGER, Christian ; ALOTHMAN ALTERKAWI, Ahmad Bader</creator><creatorcontrib>SATTLER, Sebastian ; VOCKENBERGER, Christian ; ALOTHMAN ALTERKAWI, Ahmad Bader</creatorcontrib><description>A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE ; SEMICONDUCTOR DEVICES ; WAVEGUIDES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230209&DB=EPODOC&CC=US&NR=2023044122A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230209&DB=EPODOC&CC=US&NR=2023044122A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SATTLER, Sebastian</creatorcontrib><creatorcontrib>VOCKENBERGER, Christian</creatorcontrib><creatorcontrib>ALOTHMAN ALTERKAWI, Ahmad Bader</creatorcontrib><title>Component Carrier and Method of Manufacturing a Component Carrier</title><description>A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WAVEGUIDES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB0zs8tyM9LzStRcE4sKspMLVJIzEtR8E0tychPUchPU_BNzCtNS0wuKS3KzEtXSFTAUM_DwJqWmFOcyguluRmU3VxDnD10Uwvy41OLCxKTU_NSS-JDg40MjIwNTEwMjYwcDY2JUwUAktsyGA</recordid><startdate>20230209</startdate><enddate>20230209</enddate><creator>SATTLER, Sebastian</creator><creator>VOCKENBERGER, Christian</creator><creator>ALOTHMAN ALTERKAWI, Ahmad Bader</creator><scope>EVB</scope></search><sort><creationdate>20230209</creationdate><title>Component Carrier and Method of Manufacturing a Component Carrier</title><author>SATTLER, Sebastian ; VOCKENBERGER, Christian ; ALOTHMAN ALTERKAWI, Ahmad Bader</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023044122A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WAVEGUIDES</topic><toplevel>online_resources</toplevel><creatorcontrib>SATTLER, Sebastian</creatorcontrib><creatorcontrib>VOCKENBERGER, Christian</creatorcontrib><creatorcontrib>ALOTHMAN ALTERKAWI, Ahmad Bader</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SATTLER, Sebastian</au><au>VOCKENBERGER, Christian</au><au>ALOTHMAN ALTERKAWI, Ahmad Bader</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Component Carrier and Method of Manufacturing a Component Carrier</title><date>2023-02-09</date><risdate>2023</risdate><abstract>A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2023044122A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES |
| title | Component Carrier and Method of Manufacturing a Component Carrier |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T17%3A43%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SATTLER,%20Sebastian&rft.date=2023-02-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023044122A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |