SEMICONDUCTOR PACKAGE

The present disclosure provides a semiconductor package capable of improving performance and reliability. The semiconductor package of the present disclosure includes a first device and a second device that are electrically connected to each other, the first device includes a substrate, a first pad...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOI, Il-Joo, PAE, Sang Woo, BAE, Jin Soo, CHOI, Deok-Seon, RHEW, Keun-Ho, NOH, Hyung Gyun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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