SEMICONDUCTOR MEMORY DEVICE
According to one embodiment, a semiconductor memory device includes: first and second circuit units, a driver circuit, an input/output pad, first and second power supply pads, and first and second interconnects. The first interconnect is configured to provide coupling between the first circuit unit...
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creator | DOME, Masato FUKUDA, Ryo YAMAMOTO, Kensuke KUBOTA, Kenro KOYANAGI, Masaru MATSUNO, Junya |
description | According to one embodiment, a semiconductor memory device includes: first and second circuit units, a driver circuit, an input/output pad, first and second power supply pads, and first and second interconnects. The first interconnect is configured to provide coupling between the first circuit unit and the first power supply pad. The second interconnect is configured to provide coupling between the second circuit unit and the first power supply pad and have no electrical coupling to the first interconnect. |
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The first interconnect is configured to provide coupling between the first circuit unit and the first power supply pad. The second interconnect is configured to provide coupling between the second circuit unit and the first power supply pad and have no electrical coupling to the first interconnect.</description><language>eng</language><subject>ELECTRICITY ; INFORMATION STORAGE ; PHYSICS ; STATIC STORES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=US&NR=2023028971A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=US&NR=2023028971A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DOME, Masato</creatorcontrib><creatorcontrib>FUKUDA, Ryo</creatorcontrib><creatorcontrib>YAMAMOTO, Kensuke</creatorcontrib><creatorcontrib>KUBOTA, Kenro</creatorcontrib><creatorcontrib>KOYANAGI, Masaru</creatorcontrib><creatorcontrib>MATSUNO, Junya</creatorcontrib><title>SEMICONDUCTOR MEMORY DEVICE</title><description>According to one embodiment, a semiconductor memory device includes: first and second circuit units, a driver circuit, an input/output pad, first and second power supply pads, and first and second interconnects. 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The first interconnect is configured to provide coupling between the first circuit unit and the first power supply pad. The second interconnect is configured to provide coupling between the second circuit unit and the first power supply pad and have no electrical coupling to the first interconnect.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ELECTRICITY INFORMATION STORAGE PHYSICS STATIC STORES |
title | SEMICONDUCTOR MEMORY DEVICE |
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