IMMERSION COOLING SYSTEM

An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed...

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Hauptverfasser:	LIN, Chia-Yi, TSAI, Wen-Yin, LIU, Hsuan-Ting, CHEN, Li-Hsiu, JIAN, Yan-Hui, CHANG, Ren-Chun, LIN, Wei-Chih
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	LIN, Chia-Yi TSAI, Wen-Yin LIU, Hsuan-Ting CHEN, Li-Hsiu JIAN, Yan-Hui CHANG, Ren-Chun LIN, Wei-Chih
description	An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023026658A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023026658A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023026658A13</originalsourceid><addsrcrecordid>eNrjZJDw9PV1DQr29PdTcPb39_H0c1cIjgwOcfXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGBkZmZqYWjobGxKkCAIdgINo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>IMMERSION COOLING SYSTEM</title><source>esp@cenet</source><creator>LIN, Chia-Yi ; TSAI, Wen-Yin ; LIU, Hsuan-Ting ; CHEN, Li-Hsiu ; JIAN, Yan-Hui ; CHANG, Ren-Chun ; LIN, Wei-Chih</creator><creatorcontrib>LIN, Chia-Yi ; TSAI, Wen-Yin ; LIU, Hsuan-Ting ; CHEN, Li-Hsiu ; JIAN, Yan-Hui ; CHANG, Ren-Chun ; LIN, Wei-Chih</creatorcontrib><description>An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=US&NR=2023026658A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=US&NR=2023026658A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, Chia-Yi</creatorcontrib><creatorcontrib>TSAI, Wen-Yin</creatorcontrib><creatorcontrib>LIU, Hsuan-Ting</creatorcontrib><creatorcontrib>CHEN, Li-Hsiu</creatorcontrib><creatorcontrib>JIAN, Yan-Hui</creatorcontrib><creatorcontrib>CHANG, Ren-Chun</creatorcontrib><creatorcontrib>LIN, Wei-Chih</creatorcontrib><title>IMMERSION COOLING SYSTEM</title><description>An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDw9PV1DQr29PdTcPb39_H0c1cIjgwOcfXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGBkZmZqYWjobGxKkCAIdgINo</recordid><startdate>20230126</startdate><enddate>20230126</enddate><creator>LIN, Chia-Yi</creator><creator>TSAI, Wen-Yin</creator><creator>LIU, Hsuan-Ting</creator><creator>CHEN, Li-Hsiu</creator><creator>JIAN, Yan-Hui</creator><creator>CHANG, Ren-Chun</creator><creator>LIN, Wei-Chih</creator><scope>EVB</scope></search><sort><creationdate>20230126</creationdate><title>IMMERSION COOLING SYSTEM</title><author>LIN, Chia-Yi ; TSAI, Wen-Yin ; LIU, Hsuan-Ting ; CHEN, Li-Hsiu ; JIAN, Yan-Hui ; CHANG, Ren-Chun ; LIN, Wei-Chih</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023026658A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN, Chia-Yi</creatorcontrib><creatorcontrib>TSAI, Wen-Yin</creatorcontrib><creatorcontrib>LIU, Hsuan-Ting</creatorcontrib><creatorcontrib>CHEN, Li-Hsiu</creatorcontrib><creatorcontrib>JIAN, Yan-Hui</creatorcontrib><creatorcontrib>CHANG, Ren-Chun</creatorcontrib><creatorcontrib>LIN, Wei-Chih</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN, Chia-Yi</au><au>TSAI, Wen-Yin</au><au>LIU, Hsuan-Ting</au><au>CHEN, Li-Hsiu</au><au>JIAN, Yan-Hui</au><au>CHANG, Ren-Chun</au><au>LIN, Wei-Chih</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IMMERSION COOLING SYSTEM</title><date>2023-01-26</date><risdate>2023</risdate><abstract>An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.</abstract><oa>free_for_read</oa></addata></record>
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	IMMERSION COOLING SYSTEM
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