METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a suppo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Johnson, David, Johnson, Chris, Martinez, Linnell, Pays-Volard, David, Grivna, Gordon M, Westerman, Russell
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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