STRUCTURE MANUFACTURING METHOD

STRUCTURE MANUFACTURING METHOD

A structure is manufactured by forming a mask that has an opening pattern on a surface of a substrate, etching the surface of the substrate with the mask to form a recessed portion corresponding to the opening pattern of the mask, forming a thin film including aluminum on a bottom surface of the rec...

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1. Verfasser: UMEZAWA, Tomokazu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator UMEZAWA, Tomokazu
description A structure is manufactured by forming a mask that has an opening pattern on a surface of a substrate, etching the surface of the substrate with the mask to form a recessed portion corresponding to the opening pattern of the mask, forming a thin film including aluminum on a bottom surface of the recessed portion in a state where the mask remains, treating the thin film including aluminum with hot water to change the thin film into a fine recessed and projected layer including alumina hydrate smaller than the recessed portion, etching the bottom surface of the recessed portion, on which the fine recessed and projected layer is formed, in a state where the mask remains to form a fine recessed and projected structure on the bottom surface of the recessed portion, and thereafter removing the mask and the fine recessed and projected structure, which remains after the etching step.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title STRUCTURE MANUFACTURING METHOD
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