POLYESTER RESIN COMPOSITION, POLYESTER FILM, AND LAMINATE FOR ELECTRONIC DEVICE

The present disclosure relates to a polyester resin composition including a polyester resin including a diol residue and a dicarboxylic acid residue, wherein the diol residue includes a cyclohexanedimethanol residue and the dicarboxylic acid residue includes an isophthalic acid residue and a terepht...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HEO, Young Min, YEON, Jewon, LIM, Byeong Jae
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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