DIE COUPLING USING A SUBSTRATE WITH A GLASS CORE

Embodiments described herein may be related to apparatuses, processes, and techniques related to via structures and/or planar structures within a glass core of a substrate to facilitate high-speed signaling with a die coupled with the substrate. In embodiments, the substrate may be coupled with an i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAMGAING, Telesphor, SWAN, Johanna M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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