SEMICONDUCTOR PACKAGE

A semiconductor package includes a semiconductor chip, a redistribution structure below the semiconductor chip, a first insulating layer below the redistribution structure, a pad below the first insulating layer, the pad being in contact with the redistribution structure, and a bump below the pad, w...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, Seokhyun, KIM, Jongyoun, JANG, Yeonho, JANG, Jaegwon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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