ELECTRONIC DEVICE INCLUDING BACK SURFACE PLATE AND MANUFACTURING METHOD OF BACK SURFACE PLATE

ELECTRONIC DEVICE INCLUDING BACK SURFACE PLATE AND MANUFACTURING METHOD OF BACK SURFACE PLATE

According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE, Hosoon, LEE, Wonsun, CHOI, Hyunsuk
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
CHEMISTRY
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
GLASS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METALLURGY
MINERAL OR SLAG WOOL
PHYSICS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LEE, Hosoon
LEE, Wonsun
CHOI, Hyunsuk
description According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022396515A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022396515A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022396515A13</originalsourceid><addsrcrecordid>eNrjZIh19XF1Dgny9_N0VnBxDfN0dlXw9HP2CXXx9HNXcHJ09lYIDg1ycwQKB_g4hrgqOPq5KPg6-oUChUJCg0CKfF1DPPxdFPzdsCjnYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkZGxpZmpoamjobGxKkCAHTDMxA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC DEVICE INCLUDING BACK SURFACE PLATE AND MANUFACTURING METHOD OF BACK SURFACE PLATE</title><source>esp@cenet</source><creator>LEE, Hosoon ; LEE, Wonsun ; CHOI, Hyunsuk</creator><creatorcontrib>LEE, Hosoon ; LEE, Wonsun ; CHOI, Hyunsuk</creatorcontrib><description>According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.</description><language>eng</language><subject>CALCULATING ; CHEMISTRY ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; GLASS ; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ; METALLURGY ; MINERAL OR SLAG WOOL ; PHYSICS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221215&amp;DB=EPODOC&amp;CC=US&amp;NR=2022396515A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221215&amp;DB=EPODOC&amp;CC=US&amp;NR=2022396515A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, Hosoon</creatorcontrib><creatorcontrib>LEE, Wonsun</creatorcontrib><creatorcontrib>CHOI, Hyunsuk</creatorcontrib><title>ELECTRONIC DEVICE INCLUDING BACK SURFACE PLATE AND MANUFACTURING METHOD OF BACK SURFACE PLATE</title><description>According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.</description><subject>CALCULATING</subject><subject>CHEMISTRY</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>GLASS</subject><subject>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh19XF1Dgny9_N0VnBxDfN0dlXw9HP2CXXx9HNXcHJ09lYIDg1ycwQKB_g4hrgqOPq5KPg6-oUChUJCg0CKfF1DPPxdFPzdsCjnYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkZGxpZmpoamjobGxKkCAHTDMxA</recordid><startdate>20221215</startdate><enddate>20221215</enddate><creator>LEE, Hosoon</creator><creator>LEE, Wonsun</creator><creator>CHOI, Hyunsuk</creator><scope>EVB</scope></search><sort><creationdate>20221215</creationdate><title>ELECTRONIC DEVICE INCLUDING BACK SURFACE PLATE AND MANUFACTURING METHOD OF BACK SURFACE PLATE</title><author>LEE, Hosoon ; LEE, Wonsun ; CHOI, Hyunsuk</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022396515A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>CALCULATING</topic><topic>CHEMISTRY</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>GLASS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, Hosoon</creatorcontrib><creatorcontrib>LEE, Wonsun</creatorcontrib><creatorcontrib>CHOI, Hyunsuk</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, Hosoon</au><au>LEE, Wonsun</au><au>CHOI, Hyunsuk</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE INCLUDING BACK SURFACE PLATE AND MANUFACTURING METHOD OF BACK SURFACE PLATE</title><date>2022-12-15</date><risdate>2022</risdate><abstract>According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2022396515A1
source esp@cenet
subjects CALCULATING
CHEMISTRY
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
GLASS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METALLURGY
MINERAL OR SLAG WOOL
PHYSICS
title ELECTRONIC DEVICE INCLUDING BACK SURFACE PLATE AND MANUFACTURING METHOD OF BACK SURFACE PLATE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T13%3A49%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE,%20Hosoon&rft.date=2022-12-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022396515A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true