SYSTEMS AND METHODS FOR MAXIMIZING SIGNAL INTEGRITY ON CIRCUIT BOARDS

SYSTEMS AND METHODS FOR MAXIMIZING SIGNAL INTEGRITY ON CIRCUIT BOARDS

A circuit board may include a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together and a via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board, the via comprising a first vi...

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Hauptverfasser: ETHRIDGE, Steven, MUTNURY, Bhyrav, FARKAS, Sandor
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator ETHRIDGE, Steven
MUTNURY, Bhyrav
FARKAS, Sandor
description A circuit board may include a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together and a via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board, the via comprising a first via portion comprising electrically-conductive material and having a first diameter and a first depth from a surface of the circuit board and a second via portion comprising electrically-conductive material and having a second diameter smaller than the first diameter and a second depth from the first depth.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SYSTEMS AND METHODS FOR MAXIMIZING SIGNAL INTEGRITY ON CIRCUIT BOARDS
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