SYSTEMS AND METHODS FOR MAXIMIZING SIGNAL INTEGRITY ON CIRCUIT BOARDS

SYSTEMS AND METHODS FOR MAXIMIZING SIGNAL INTEGRITY ON CIRCUIT BOARDS

A circuit board may include a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together and a via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board, the via comprising a first vi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ETHRIDGE, Steven, MUTNURY, Bhyrav, FARKAS, Sandor
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A circuit board may include a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together and a via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board, the via comprising a first via portion comprising electrically-conductive material and having a first diameter and a first depth from a surface of the circuit board and a second via portion comprising electrically-conductive material and having a second diameter smaller than the first diameter and a second depth from the first depth.