PACKAGE HAVING THICK GLASS CORE WITH HIGH ASPECT RATIO VIAS
Embodiments disclosed herein include package substrates for electronic packaging applications. In an embodiment, a package substrate comprises a first glass layer, where the first glass layer comprises a first via through the first glass layer, and the first via has an hourglass shaped cross-section...
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| creator | KAMGAING, Telesphor |
| description | Embodiments disclosed herein include package substrates for electronic packaging applications. In an embodiment, a package substrate comprises a first glass layer, where the first glass layer comprises a first via through the first glass layer, and the first via has an hourglass shaped cross-section. The package substrate may further comprise a second glass layer over the first glass layer, where the second glass layer comprises a second via through the second glass layer, and where the second via has the hourglass shaped cross-section. In an embodiment, the first via is electrically coupled to the second via. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022394849A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022394849A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022394849A13</originalsourceid><addsrcrecordid>eNrjZLAOcHT2dnR3VfBwDPP0c1cI8fB09lZw93EMDlZw9g9yVQj3DPFQ8PB091BwDA5wdQ5RCHIM8fRXCPN0DOZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRkbGliYWJpaOhsbEqQIASbMp2Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PACKAGE HAVING THICK GLASS CORE WITH HIGH ASPECT RATIO VIAS</title><source>esp@cenet</source><creator>KAMGAING, Telesphor</creator><creatorcontrib>KAMGAING, Telesphor</creatorcontrib><description>Embodiments disclosed herein include package substrates for electronic packaging applications. In an embodiment, a package substrate comprises a first glass layer, where the first glass layer comprises a first via through the first glass layer, and the first via has an hourglass shaped cross-section. The package substrate may further comprise a second glass layer over the first glass layer, where the second glass layer comprises a second via through the second glass layer, and where the second via has the hourglass shaped cross-section. In an embodiment, the first via is electrically coupled to the second via.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221208&DB=EPODOC&CC=US&NR=2022394849A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221208&DB=EPODOC&CC=US&NR=2022394849A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMGAING, Telesphor</creatorcontrib><title>PACKAGE HAVING THICK GLASS CORE WITH HIGH ASPECT RATIO VIAS</title><description>Embodiments disclosed herein include package substrates for electronic packaging applications. In an embodiment, a package substrate comprises a first glass layer, where the first glass layer comprises a first via through the first glass layer, and the first via has an hourglass shaped cross-section. The package substrate may further comprise a second glass layer over the first glass layer, where the second glass layer comprises a second via through the second glass layer, and where the second via has the hourglass shaped cross-section. In an embodiment, the first via is electrically coupled to the second via.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAOcHT2dnR3VfBwDPP0c1cI8fB09lZw93EMDlZw9g9yVQj3DPFQ8PB091BwDA5wdQ5RCHIM8fRXCPN0DOZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRkbGliYWJpaOhsbEqQIASbMp2Q</recordid><startdate>20221208</startdate><enddate>20221208</enddate><creator>KAMGAING, Telesphor</creator><scope>EVB</scope></search><sort><creationdate>20221208</creationdate><title>PACKAGE HAVING THICK GLASS CORE WITH HIGH ASPECT RATIO VIAS</title><author>KAMGAING, Telesphor</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022394849A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMGAING, Telesphor</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMGAING, Telesphor</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PACKAGE HAVING THICK GLASS CORE WITH HIGH ASPECT RATIO VIAS</title><date>2022-12-08</date><risdate>2022</risdate><abstract>Embodiments disclosed herein include package substrates for electronic packaging applications. In an embodiment, a package substrate comprises a first glass layer, where the first glass layer comprises a first via through the first glass layer, and the first via has an hourglass shaped cross-section. The package substrate may further comprise a second glass layer over the first glass layer, where the second glass layer comprises a second via through the second glass layer, and where the second via has the hourglass shaped cross-section. In an embodiment, the first via is electrically coupled to the second via.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | PACKAGE HAVING THICK GLASS CORE WITH HIGH ASPECT RATIO VIAS |
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