COPPER ETCHING SOLUTION

A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups...

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Hauptverfasser:	Komeda, Takuya, Ishida, Tetsuji, Shimizu, Ryoyu, Yamamoto, Hisamitsu, Kato, Kazunari
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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creator	Komeda, Takuya Ishida, Tetsuji Shimizu, Ryoyu Yamamoto, Hisamitsu Kato, Kazunari
description	A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.
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subjects	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
title	COPPER ETCHING SOLUTION
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