Adhesive film, anti-PID encapsulation adhesive film, composition forming adhesive film, and photovoltaic module and laminated glass

Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal ox...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU, Ting, DU, Ganhong, WEI, Mengjuan, HOU, Hongbing, WANG, Fucheng, ZHOU, Guangda, WANG, Haonan, SANG, Yan
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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